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Tensilica Announces Design Center Agreement
With Kaga Electronics

SANTA CLARA, Calif. and YOKAHAMA, Japan, November 5, 2002 – Tensilica®, Inc., the leading supplier of configurable and extensible microprocessor cores, today announced an agreement with one of Japan’s premier design centers, Kaga Electronics. As a design services company to many of Japan’s leading hardware and software consumer electronics companies, Kaga Electronics will assist these leading companies with Xtensa® core-based system-on-chip (SoC) designs for a variety of high-volume consumer electronics applications such as DVDs, printers and games.


Kaga Electronics joins a growing list of third-party companies that have joined the popular “Tensilica Xtensions Network.” Design center members have been authorized to assist Xtensa licensees with the configuration, implementation and evaluation of SoC designs.

SOLNET and C4 Technology Form Encryption Security Alliance

May 10, 2002

Kaga Solution Network Co., Ltd. (SOLNET), has formed an encryption security technologies alliance with C4 Technology, Inc. SOLNET (website: http://www.webcom.co.jp) is a network systems subsidiary of Kaga Electronics Co., Ltd. (website: http://www.taxan.co.jp). C4 Technologies (website: http://www.c4t.jp) develops and sells products based on its C4 series encryption technology. It is a subsidiary of Focus Systems Corporation (website: http://www.focus-s.com), which develops telecommunications control and governmental software.

As a first step in the alliance, C4 Technologies will transfer to SOLNET its proprietary Secure Wireless LAN technology, which was unveiled on April 30. SOLNET will harness the technology in launching encryption products to wireless LAN manufacturers and users. SOLNET will sell LAN server/client software and external box/client packages. SOLNET also plans to sell software and boxes for wireless connections between buildings. Both partners will use Secure Wireless LAN technology to meet growing demand for wireless LAN systems. They will highlight this technology's superior capabilities in safeguarding against tapping and cracking without compromising high-speed wireless performance.

 
     


   



     















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